[ WAFER MAP OCR ]

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Specification
  • Wafer Size8,12 inch
  • Minimum die size0.5mmX0.5mm
  • Automatic Alignment
  • Auto Merge Map File
Inspection Function
  • Compares MAP File to Wafer to Detect Anomaly
  • Map with Anomaly will not Flow to Client Computer
  • Replaces Human Eye Inspection of Map, Accelerating Pace of Production
  • Easily Accessible Inspection Records and Pictures
  • SECS Communication Protocol
  • MAP File Automatically Loaded with Parameters
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