[ WLCSP RFVI ]

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视觉检测功能 / Visual inspection function
  • 混批、尺寸 / Mixed batch size
  • 翻转错方向 / Flip the wrong direction
  • 空DIE / Empty Die
  • 印字瑕疵 / Printing defects
  • 字码偏移错误 / Typing Misaligned
  • IC崩裂、刮伤 / IC crack, scratch
  • 脏污、灰尘 / Dirt, dust
  • 封膜不良 / Bad sealing membrane
  • 涂布剥离 / Coating Stripping

Machine Spec
  • Camera5M Pixel CCD Camera
  • Resolution0.0015~0.0075mm/Pixel
  • FOV8mm~14mm
  • LensZoom Lens 0.75~4X
  • UPH(FVI Function)Pitch 4mm Product Max 20K
    Pith 8mm Product Max 10K
  • Measurement Tolerances±1 pixel
  • Over Key2%
  • Over Key(Does not include external factors)0.30%
  • Auto InspectionYes
  • Map DataYes
  • Tear cover tape & Paste new cover tapeYes
  • SECS/GEM System(On server systems)Option
  • Good die with bad die exchange from Reel to reelYes
  • Sealing Inspection FunctionYes
  • Hot sealing knife setYes
  • Recycle Reel FunctionYes
  • Die3x3~15x15mm
  • All hot sealing & cold sealing cover tapeYes
  • Hot Sealing able to adjust by spacingYes
  • Nozzle head specifications0.6~4.0mm
  • P&P Accuracy±5 um
  • Locating MachanismComputer - Controlled machinery
  • Lead Time3.5Month
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